Printed circuit board assemblers read blueprints and drawings to assemble printed circuit boards. They use hand- and automated soldering tools and machines to connect electronic components to the board.
No competences in this bucket.
Through-hole technology or THT is a method of mounting electronic components onto the printed circuit board through inserting leads on the components into holes in the circuit board and soldering the components to the board. THT components attached in this way are usually larger than SMT components, such as capacitors or coils.
The functioning of electronic circuit boards, processors, chips, and computer hardware and software, including programming and applications.
Electronic components, made up from a set of electronic circuits which are placed on semiconductor material, such as silicon. Integrated circuits (IC) can hold billions of electronic components on a microscale and are one of basic components of electronic devices.
Printed circuit boards (PCB) are essential components to almost all electronic devices. They consist of thin wafers or substrates on which electronic components, such as microchips, are placed. The electronic components are electrically connected through conductive tracks and pads.
Semiconductors are essential components of electronic circuits and contain properties of both insulators, such as glass, and conductors, such as copper. Most semiconductors are crystals made of silicon or germanium. By introducing other elements in the crystal through doping, the crystals turn into semiconductors. Depending on the amount of electrons created by the doping process, the crystals turn into N-type semiconductors, or P-type semiconductors.
Use through-hole technology (THT) to attach the leads of larger electronic components through the corresponding holes in printed circuit boards. Apply this technique manually.
Operate the insertion mount machine or inserter to insert the leads of electronic components into holes in the printed circuit boards.
Attach electronic components to the printed circuit board through applying soldering techniques. Electronic components are placed in holes in through-hole assembly (THT), or are placed on the surface of PCB in surface-mount assembly (SMT).
Add a protective layer of coating to the finished printed circuit board.
Implement the relevant procedures, strategies and use the proper equipment to promote local or national security activities for the protection of data, people, institutions, and property.
Read and comprehend circuit diagrams showing the connections between the devices, such as power and signal connections.
Prepare the loaded printed circuit boards for solder operations. Clean the board and mark designated areas.
Solder electronic components onto bare electronic boards to create loaded electronic boards using hand soldering tools or soldering machinery.
Ensure that the assembled products are conform to the specifications given.
Ensure operative processes are finished at a previously agreed-upon time.
Read and interpret drawings listing all the parts and subassemblies of a certain product. The drawing identifies the different components and materials and provides instructions on how to assemble a product.
No competences in this bucket.
The process of reproducing 3D objects by using 3D printing technologies.
Subdiscipline of chemistry that studies the chemical reactions that take place during the interaction of an electrolyte, a chemical substance that works as an ionic conductor, and an electrode, or an electrical conductor. Electrochemistry deals with the electrical charge that moves between the electrolyte and electrodes and studies the interaction between chemical changes and electrical energy. Electrochemistry is famously used in the manufacture of batteries.
Standards and guidelines with regards to the use and manufacture of electronics and printed circuit boards. These regulations provide rules and guidelines on topics such as general safety rules, electronic equipment manufacture, electronic equipment testing, and qualifications.
Upkeep procedures and technical working of machines that produce printed graphical material.
The materials, such as paper, film, metal foils, and glass, on which texts or designs can be transferred by applying ink through direct pressure or with intermediate rollers.
Methods, processes, and restrictions related to printing on machines that produce large quantities and sizes of graphic print materials.
Surface-mount technology or SMT is a method where the electronic components are placed on the surface of the printed circuit board. SMT components attached in this way are usually sensitive, small components such as resistors, transistors, diodes, and integrated circuits.
The process of plating together different types of metals through hydrolysis, silver plating, chromium plating, or copper plating. Electroplating allows for the combination of different metals with different properties in product manufacturing.
The preservation and restoration of products and systems, and the methods and logistics of these practices.
Microelectronics is a subdiscipline of electronics and relates the study, design, and manufacture of small electronic components, such as microchips.
Computer processors on a microscale that integrate the computer central processing unit (CPU) on a single chip.
Printed circuit board (PCB) testing methods consist of those processes in which PCB components or systems are tested, such as the in-circuit test (ICT), joint test action group (JTAG) test, and automated optical inspection (AOI).
The techniques and processes to reproduce text and images using a master form or template such as letterpress printing, gravure, and laser printing.
No competences in this bucket.
Clean the printed circuit boards and components as necessary before, during, and after the assembly process.
Diagnose and detect malfunctions in microelectronic systems, products, and components and remove, replace, or repair these components when necessary. Execute preventative equipment maintenance tasks, such as storing the components in clean, dust-free, and non-humid spaces.
Use graphical ICT tools, such as Autodesk Maya, Blender which enable digital editing, modelling, rendering and composition of graphics. These tools are based in mathematical representation of three-dimensional objects.
Operate machinery for various types of printed documents, adjusting the font, paper size, and weight. This allows ascenders and descenders to be correctly placed.
Operate surface-mount technology (SMT) machines and equipment to place and solder surface-mount devices (SMD) onto the printed circuit board with high precision.
Operate the wave soldering machine to solder electronic components onto the printed circuit board. Here, the board is moved over a wave of liquid solder and the connections inserted through the board are bonded firmly to the circuit board.
Safely pack sensitive electronic equipment for storage and transport.
Test microelectronics using appropriate equipment. Gather and analyse data. Monitor and evaluate system performance and take action if needed.
Test the printed circuit board with special testing adapters to ensure optimal efficiency, functionality, and that everything works according to design. Adapt the testing devices to the type of circuit board.
Check the printed circuit board for solder defects and make adjustments as required.
Clean components before fixing them to other compounds or units of components during the assembly process.
While designing products, determine if materials are suitable and available for production.
Dispose of dangerous materials such as chemical or radioactive substances according to environmental and to health and safety regulations.
Maintain records of the progress of the work including time, defects, malfunctions, etc.
Operate machinery used for the making of small systems or components with a high level of precision.
Ensure that the processes of packing, storage and shipment of finished products meet the requirements.
Remove defective parts and replace them with functioning components.
Identify, report and repair equipment damage and malfunctions. Communicate with field representatives and manufacturers to obtain repair and replacement components.
Use diagnostic equipment to measure current, resistance and voltage. Handle sophisticated multimeters to measure inductance, capacitance and current transistor gain.