Automated optical inspection operators (AOI operators) operate automated optical inspection machines to inspect assembled printed circuit boards. They read blueprints and inspect the finished or in-process PCB assemblies for flaws or defects.
No competences in this bucket.
During automated optical inspection (AOI), printed circuit boards (PCB) or surface-mount devices (SMD) are inspected by means of an automated optical inspection machine. During each automated optical inspection test, dozens of images are captured with a special camera and compared to previous assembled boards to detect any anomalies.
The national and international quality and safety standards and regulations with regards to the use and manufacture of electronic equipment and its components, such as semiconductors and printed circuit boards.
The functioning of electronic circuit boards, processors, chips, and computer hardware and software, including programming and applications.
Printed circuit boards (PCB) are essential components to almost all electronic devices. They consist of thin wafers or substrates on which electronic components, such as microchips, are placed. The electronic components are electrically connected through conductive tracks and pads.
The procedures to inspect a product or system to ensure that it is according to specifications and requirements.
Evaluate scans or images taken with imaging or optical equipment and machinery.
Read and comprehend circuit diagrams showing the connections between the devices, such as power and signal connections.
Inspect the quality of assembled printed circuit boards (PCB) or surface-mount devices (SMD) through operating the automated optical inspection machine. During each test, dozens of images are captured with a special camera and compared to previous assembled boards.
Communicate testing information such as testing schedules, samples testing statistics and test results, to the relevant departments.
Ensure that the assembled products are conform to the specifications given.
Use various techniques to ensure the product quality is respecting the quality standards and specifications. Oversee defects, packaging and sendbacks of products to different production departments.
Ensure operative processes are finished at a previously agreed-upon time.
Observing machine operations and evaluating product quality thereby ensuring conformity to standards.
Read and interpret drawings listing all the parts and subassemblies of a certain product. The drawing identifies the different components and materials and provides instructions on how to assemble a product.
Read and comprehend standard blueprints, machine, and process drawings.
Maintain required company records and forms in order to report any defective materials or questionable conditions of manufacturing machinery and equipment.
No competences in this bucket.
Standards and guidelines with regards to the use and manufacture of electronics and printed circuit boards. These regulations provide rules and guidelines on topics such as general safety rules, electronic equipment manufacture, electronic equipment testing, and qualifications.
Surface-mount technology or SMT is a method where the electronic components are placed on the surface of the printed circuit board. SMT components attached in this way are usually sensitive, small components such as resistors, transistors, diodes, and integrated circuits.
Through-hole technology or THT is a method of mounting electronic components onto the printed circuit board through inserting leads on the components into holes in the circuit board and soldering the components to the board. THT components attached in this way are usually larger than SMT components, such as capacitors or coils.
The regulations and legal provisions governing waste removal activities.
Elements that indicate or influence instrument performance. A first indication of the performance of the instrument is the accuracy or precision of the instrument, such as its response time, resolution, and range. A second indication of performance is the technical performance of the instrument, such as its power level, the electromagnetic interference, and transient voltages. A third indication of performance are environmental factors that can influence instrument performance, such as humidity, operating temperatures, or dust.
Electronic components, made up from a set of electronic circuits which are placed on semiconductor material, such as silicon. Integrated circuits (IC) can hold billions of electronic components on a microscale and are one of basic components of electronic devices.
Microelectronics is a subdiscipline of electronics and relates the study, design, and manufacture of small electronic components, such as microchips.
Subdiscipline of engineering that deals with the development of optical instruments and applications, such as telescopes, microscopes, lenses, lasers, fibre optic communication, and imaging systems.
Semiconductors are essential components of electronic circuits and contain properties of both insulators, such as glass, and conductors, such as copper. Most semiconductors are crystals made of silicon or germanium. By introducing other elements in the crystal through doping, the crystals turn into semiconductors. Depending on the amount of electrons created by the doping process, the crystals turn into N-type semiconductors, or P-type semiconductors.
No competences in this bucket.
Write records of the repairs and maintenance interventions undertaken, of parts and materials used, and other repair facts.
Make sure that the measurable factors which define the operation of a system correspond to the predetermined norms.
Maintain records of the progress of the work including time, defects, malfunctions, etc.
Collaborate with engineers to ensure common understanding and discuss product design, development and improvement.
Maintain equipment used for testing the quality of systems and products.
Remove defective materials from the production line.
Research equipment or required machine parts; compare sources, prices and delivery times.
Identify, report and repair equipment damage and malfunctions. Communicate with field representatives and manufacturers to obtain repair and replacement components.
Send equipment that didn't pass inspection back to the assembly line for re-assembly.
Write the results and conclusions of the inspection in a clear and intelligible way. Log the inspection's processes such as contact, outcome, and steps taken.