Microsystem engineering technicians collaborate with micro-system engineers in the development of microsystems or microelectromechanical systems (MEMS) devices, which can be integrated in mechanical, optical, acoustic, and electronic products. Microsystem engineering technicians are responsible for building, testing, and maintaining the microsystems.
No competences in this bucket.
Microelectromechanical systems (MEMS) are miniaturised electromechanical systems made using processes of microfabrication. MEMS consist of microsensors, microactuators, microstructures, and microelectronics. MEMS can be used in a range of appliances, such as ink jet printer heads, digital light processors, gyroscopes in smart phones, accelerometers for airbags, and miniature microphones.
The methods of testing the quality, accuracy, and performance of microsystems and microelectromechanical systems (MEMS) and their materials and components before, during, and after the building of the systems, such as parametric tests and burn-in tests.
The drawings detailing the design of products, tools, and engineering systems.
The assembly of nano, micro or mesoscale systems and components with dimensions between 1 µm to 1 mm. Because of the need for precision on a microscale, micro assemblies require reliable visual alignment equipment, such as ion beam imaging systems and stereo electronic microscopes, as well as precision tools and machines, such as microgrippers. The microsystems are assembled according to techniques of doping, thin films, etching, bonding, microlithography, and polishing.
The national and international requirements, specifications and guidelines to ensure that products, services and processes are of good quality and fit for purpose.
Integrate the microelectromechanical systems (MEMS) into microdevices through assembly, joining, fastening, and encapsulation techniques. Packaging allows for the support and protection of the integrated circuits, printed circuit boards, and associate wire bonds.
Build microelectromechanical systems (MEMS) using microscopes, tweezers, or pick-and-place robots. Slice substrates from single wafers and bond components onto the wafer surface through soldering and bonding techniques, such as eutectic soldering and silicon fusion bonding (SFB). Bond the wires through special wire bonding techniques such as thermocompression bonding, and hermetically seal the system or device through mechanical sealing techniques or micro shells. Seal and encapsulate the MEMS in vacuum.
Align tolerances while inserting and placing different parts to avoid tolerance discrepancy and misfits in assembly.
Test microelectromechanical systems (MEMS) using appropriate equipment and testing techniques, such as thermal shock tests, thermal cycling tests, and burn-in tests. Monitor and evaluate system performance and take action if needed.
Adjust designs of products or parts of products so that they meet requirements.
Align and lay out components in order to put them together correctly according to blueprints and technical plans.
Assist engineers or scientists with conducting experiments, performing analysis, developing new products or processes, constructing theory, and quality control.
Fasten components together according to blueprints and technical plans in order to create subassemblies or finished products.
Use various techniques to ensure the product quality is respecting the quality standards and specifications. Oversee defects, packaging and sendbacks of products to different production departments.
Collaborate with engineers to ensure common understanding and discuss product design, development and improvement.
Ensure operative processes are finished at a previously agreed-upon time.
Prepare early models or prototypes in order to test concepts and replicability possibilities. Create prototypes to assess for pre-production tests.
Read and interpret drawings listing all the parts and subassemblies of a certain product. The drawing identifies the different components and materials and provides instructions on how to assemble a product.
Read the technical drawings of a product made by the engineer in order to suggest improvements, make models of the product or operate it.
Record data which has been identified specifically during preceding tests in order to verify that outputs of the test produce specific results or to review the reaction of the subject under exceptional or unusual input.
Wear garments appropriate for environments that require a high level of cleanliness to control the level of contamination.
No competences in this bucket.
Micro-opto-electro-mechanics (MOEM) combines microelectronics, microoptics and micromechanics in the development of MEM devices with optical features, such as optical switches, optical cross-connects, and microbolometers.
Surface-mount technology or SMT is a method where the electronic components are placed on the surface of the printed circuit board. SMT components attached in this way are usually sensitive, small components such as resistors, transistors, diodes, and integrated circuits.
Set of interconnected mechanisms and components, such as controllers or sensing elements, that use programming logic to automate the operation and behaviour of a process or system without a continuous human intervention, to achieve a desired performance such as stability.
The computer-aided design (CAD) software for creating, modifying, analysing or optimising a design.
Firmware is a software program with a read-only memory (ROM) and a set of instructions that is permanently inscribed on a hardware device. Firmware is commonly used in electronic systems such as computers, mobile phones, and digital cameras.
Instruments used for precision measuring or manufacture, such as micrometers, calipers, gauges, scales, and microscopes.
Precision or fine mechanics is a subdiscipline in engineering that focuses on the design and development of smaller precision machines.
Diagnose and detect malfunctions in microelectromechanical systems (MEMS) and remove, replace, or repair these components when necessary. Execute preventative equipment maintenance tasks, such as storing the components in clean, dust-free, and non-humid spaces.
No competences in this bucket.
Apply and work with a variety of techniques in the process of soldering, such as soft soldering, silver soldering, induction soldering, resistance soldering, pipe soldering, mechanical and aluminium soldering.
Explain technical details to non-technical customers, stakeholders, or any other interested parties in a clear and concise manner.
Assist with the integration of new systems, products, methods, and components in the production line. Ensure that production workers are properly trained and follow the new requirements.
Maintain records of the progress of the work including time, defects, malfunctions, etc.
Observing machine operations and evaluating product quality thereby ensuring conformity to standards.
Operate machinery used for the making of small systems or components with a high level of precision.
Measure the size of a processed part when checking and marking it to check if it is up to standard by use of two and three dimensional precision measuring equipment such as a caliper, a micrometer, and a measuring gauge.
Program permanent software with a read-only memory (ROM) on a hardware device, such as an integrated circuit.
Identify, report and repair equipment damage and malfunctions. Communicate with field representatives and manufacturers to obtain repair and replacement components.
Use computer-aided manufacturing (CAM) programmes to control machinery and machine tools in the creation, modification, analysis, or optimisation as part of the manufacturing processes of workpieces.
Use electronic, mechanical, electric, or optical precision tools, such as drilling machines, grinders, gear cutters and milling machines to boost accuracy while machining products.
Compose technical customer reports understandable for people without technical background.