Semiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and review the products. Semiconductor processors work in cleanrooms and therefore need to wear a special lightweight outfit that fits over their clothing to prevent particles from contaminating their worksite.
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Semiconductor devices which emit light, visible or infrared, when an electric current passes through them and they get charged. Light-emitting diodes (LEDs) are produced when holes and electrons, the particles carried by the current, are combined within the semiconductor mechanism.
The functioning of electronic circuit boards, processors, chips, and computer hardware and software, including programming and applications.
Electronic components, made up from a set of electronic circuits which are placed on semiconductor material, such as silicon. Integrated circuits (IC) can hold billions of electronic components on a microscale and are one of basic components of electronic devices.
The assembly of nano, micro or mesoscale systems and components with dimensions between 1 µm to 1 mm. Because of the need for precision on a microscale, micro assemblies require reliable visual alignment equipment, such as ion beam imaging systems and stereo electronic microscopes, as well as precision tools and machines, such as microgrippers. The microsystems are assembled according to techniques of doping, thin films, etching, bonding, microlithography, and polishing.
Microelectronics is a subdiscipline of electronics and relates the study, design, and manufacture of small electronic components, such as microchips.
Semiconductors are essential components of electronic circuits and contain properties of both insulators, such as glass, and conductors, such as copper. Most semiconductors are crystals made of silicon or germanium. By introducing other elements in the crystal through doping, the crystals turn into semiconductors. Depending on the amount of electrons created by the doping process, the crystals turn into N-type semiconductors, or P-type semiconductors.
Clean semiconductor wafers using appropriate cleaning equipment, such as automated wafer cleaners, blow-off wands, and chemical baths.
Imprint the electronic circuit design onto the wafers through a process known as photolithography. First, wafers are coated with photosensitive chemicals that harden when exposed to UV light. In sealed dark rooms light is shone through the image of the design through a miniaturising lens and on to the coated wafer. When the chemical is washed off the design remains. The wafers are built up layer by layer, repeating the photo etching process in each new layer. Some layers are cooked, some layers ionised by plasma, and some are baked in metal. Each treatment changes the properties for that layer.
Inspect the quality of used materials, check the purity and molecular orientation of the semiconductor crystals, and test the wafers for surface defects using electronic testing equipment, microscopes, chemicals, X-rays, and precision measuring instruments.
Load transistors and other electronic circuit elements onto the finished silicon wafers and slice wafers into individual integrated circuits (IC's) or microchips.
Operate robotic machines to clean, buff, and polish the wafers using a process called lapping. The result is wafers of silicon with a surface roughness of less than one millionth of a millimeter.
Load raw semiconductor materials, such as polysilicon, into furnace. The resulting lake of melted silicon is then spun in a crucible and a silicon seed crystal is put into it while spinning in the opposite direction. When the melted polysilicon is allowed to cool, the seed crystal is slowly withdrawn. The result is a single semiconductor crystal with a diameter of approximately 200 millimeters.
Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.
Operate measurement instruments to measure parts of manufactured objects. Take into consideration specifications of manufacturers to perform the measuring.
Ensure that the assembled products are conform to the specifications given.
Ensure operative processes are finished at a previously agreed-upon time.
Observing machine operations and evaluating product quality thereby ensuring conformity to standards.
Monitor quality standards in manufacturing and finishing process.
Read and interpret drawings listing all the parts and subassemblies of a certain product. The drawing identifies the different components and materials and provides instructions on how to assemble a product.
Remove defective materials from the production line.
Maintain required company records and forms in order to report any defective materials or questionable conditions of manufacturing machinery and equipment.
Wear garments appropriate for environments that require a high level of cleanliness to control the level of contamination.
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Types of integrated circuits (IC), such as analog integrated circuits, digital integrated circuits, and mixed-signal integrated circuits.
The regulations and legal provisions governing waste removal activities.
The national and international requirements, specifications and guidelines to ensure that products, services and processes are of good quality and fit for purpose.
Use semiconductor automated test equipment (ATE) to check and diagnose malfunctions in semiconductors and their components, such as resistors, capacitors, and inductors. Apply different testing techniques for different components, such as wafer testing.
Prepare and apply coating, such as conformal coating, to electrical equipment and its components to protect the equipment against moisture, high temperature, and dust.
Transfer tools, materials and equipment to warehouse locations for shipping.
Implement the relevant procedures, strategies and use the proper equipment to promote local or national security activities for the protection of data, people, institutions, and property.
Read and comprehend circuit diagrams showing the connections between the devices, such as power and signal connections.
Regulate and monitor the manufacturing equipment settings and process parameters, such as its temperature and power level. Review the manufacturing process and equipment and suggest improvements.
Adhere to standards of hygiene and safety established by respective authorities.
Explain technical details to non-technical customers, stakeholders, or any other interested parties in a clear and concise manner.
Dispose of dangerous materials such as chemical or radioactive substances according to environmental and to health and safety regulations.
Use various techniques to ensure the product quality is respecting the quality standards and specifications. Oversee defects, packaging and sendbacks of products to different production departments.
Maintain records of the progress of the work including time, defects, malfunctions, etc.
Operate machinery used for the making of small systems or components with a high level of precision.
Ensure that the processes of packing, storage and shipment of finished products meet the requirements.
Repair, replace or adjust damaged electronics components or circuitry. Use hand tools and soldering and welding equipment.
Remove defective parts and replace them with functioning components.
Identify, report and repair equipment damage and malfunctions. Communicate with field representatives and manufacturers to obtain repair and replacement components.